Wireless Chipset Application Engineer - H-1B Visa Sponsors

1 employers filed 6 LCA applications for Wireless Chipset Application Engineer positions.

đź“Ť Employers Hiring for This Role

Click an employer to view their full sponsorship profile.

Wireless Chipset Application Engineer1 total
ROHDE & SCHWARZ USA, INC
COLUMBIA, MD6 filings

Work Visa Categories

H-1B
Most common US work visa for specialty occupations
Annual cap:65,000 + 20,000 (US master’s)
Lottery:Yes, weighted by wage level from FY2027
Duration:3 years, extendable to 6
Spouse work:H-4 EAD if I-140 approved
H-1B Cap-Exempt
No lottery required. Qualifying employers only
Annual cap:None. File any time
Lottery:None. No registration needed
Who qualifies:Nonprofit universities, research orgs, affiliates
Duration:Same as regular H-1B
E-3
Australian nationals only. Cap rarely reached
Annual cap:10,500. Never exhausted
Lottery:None
Duration:2 years, renewable indefinitely
Spouse work:E-3D automatic work authorization
H-1B1
Chile & Singapore nationals. Free Trade Agreement
Annual cap:6,800 (1,400 Chile + 5,400 Singapore)
Lottery:None
Duration:1 year, renewable
Spouse work:No automatic work authorization

H-1B Wage Levels Explained

LEVEL I · ENTRY
“Performs routine tasks requiring limited, if any, exercise of judgment. Work is closely supervised.”
In practice:Work is assigned and checked by a supervisor. The employee is learning the employer’s methods. Mistakes are caught and corrected by others.
Associate EngineerJunior AnalystNew Graduate
1Ă—lottery entry under FY2027 weighted system
If your LCA description lists “5+ years of experience,” “works independently,” or “leads a team”, Level I may be inconsistent with those duties and could attract RFE scrutiny.